Intel® 852GME ChipsetOverview
The Intel® 852GME Chipset, optimized for the Mobile Intel® Pentium® 4 processor, features a 533 MHz system bus and up to 2 GB of high-speed DDR 333/266/200 memory. Intel® Extreme Graphics 2 technology enables intense, realistic 3D graphics and an AGP 4X interface enables over 1 GB/s of graphics bandwidth interface for high-quality 2D, 3D and video streams.
Product information
Features and benefits
| 533/400 MHz system bus | Supports 533/400 MHz system bus for single processor configurations. |
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| Supports up to 2 GB of DDR 333/266/200 memory technology | Higher performance & flexibility. |
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| Integrated Low Voltage Differential Signaling interface (LVDS) | Higher integration which saves board space. Supports up to 1600x1200 UXGA+ panel resolution. |
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| Dual independent pipe for dual independent display | View 2 independent images on different displays. |
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| Screen image rotation | Ability to rotate the screen image 90°, 180° or 270°. |
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| 6 USB 2.0 ports. Backwards compatible to USB 1.1 | High-speed USB 2.0 peripheral support. |
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| Low power design | Advanced mobile power management. |
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| Intel® Extreme Graphics 2 technology | Delivers intense, realistic 3D graphics with sharp images and enables balanced memory usage between graphics and system for optimal performance. |
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| AGP 4X interface | Provide the advanced graphics support available, enabling over 1 GB/s of graphics bandwidth interface for high-quality 2D, 3D and video streams. |
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| Enhanced Intel SpeedStep® Technology | Real-time dynamic switching of voltage and frequency between maximum performance and battery-optimized operation, based on CPU demand, for longer battery life. |
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| Deeper sleep alert state | New dynamic power management mode operates at lower voltage than deep sleep mode for longer battery life. |
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| Ultra ATA/100 | Takes advantage of the latest industry innovations in HDD features and performance. |
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| Thin and small package technology | Intel® 852GME chipset uses Intel's most advanced Flip-Chip Ball Grid Array (FCBGA) packaging that is excellent for reducing package size and improves the chipset cooling capability. |
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Related products
Packaging information
| 82852GME (MCH) | 732 pin Micro-FCBGA |
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| 82801DBM (ICH4-M) | 421 pin Micro-BGA |
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