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Intel® E7520 and E7320 ChipsetsOverview

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Intel® E7520 and E7320 Chipsetsenlarge image

The Intel® E7520 and E7320 chipsets, the next generation Intel® dual-processor (DP) server chipset technology, enable reduced power consumption and improved platform reliability and system manageability. These chipsets enable new dual-processor servers to deliver outstanding performance, dependability and value to enterprise front-end, small-medium business (SMB), or high performance computing (HPC) applications.

Performance-Enhancing Features

Dual Intel® Xeon® processors and an 800 MHz system bus provide up to 6.4 GB/s of available bandwidth delivering a high-performance balanced platform with greater bandwidth for increased memory and I/O throughput compared to previous generation platforms.

Dual DDR2-400 memory channels deliver 6.4 GB/second bandwidth and up to 16 GB of physical memory, providing up to 20 percent increase in memory bandwidth over DDR333 and up to a 40 percent decrease in power consumption.

PCI Express* I/O delivers up to 4 GB/s throughput on each x8 interface for demanding I/O and networking applications, allowing I/O to keep pace with the rest of the platform.

Product information

Features and benefits

Supports two Intel® Xeon® processors over an 800 MHz system bus for dual-processing workstation and server systemsOptimized performance for multiple DP market segments and price points, supporting a larger number of users/transactions with faster response times.
800 MHz system bus capabilityIncreased platform bus bandwidth (50% more than 533 MHz) delivers increased system performance.
PCI Express*1Serial I/O technology that provides a direct connection between the MCH and PCI Express* devices with bandwidth up to 4 GB/s on each PCI Express* x8 interface; PCI Express offers higher bandwidth, lower latency and less I/O bottlenecks than PCI-X.
DDR2-400 memory interface
  • Offers a maximum memory bandwidth of 6.4 GB/s.
  • Decreased power consumption—especially important on dense rack, HPC and blade configurations.
  • Increased DIMMs per system providing enhanced memory scalability for memory-intensive applications.
Intel® 6700PXH 64-bit PCI hub

The Intel® 6700PXH 64-bit PCI Hub is targeted for the server market. It is a peripheral component that performs PCI bridging functions between the PCI Express* interface and the PCI Bus. It contains two PCI bus interfaces that can be independently configured to operate in PCI (33 or 66 MHz) or PCI-X Mode 1 (66, 100, or 133 MHz), for either 32 or 64 bit PCI devices. It further supports the new PCI Standard Hot-Plug Controller and Subsystem Specification Revision 1.0.

File Type/Size:  PDF 2271KB

  • Optional component introduces next-generation PCI/PCI-X performance and significant enhancements to platform flexibility.
  • Supports two independent 64-bit, 133 MHz
    PCI-X segments and two hot-plug controllers (one per segment).
Intel® Hub Interface 1.5 connection to the Memory Controller Hub (MCH)Point-to-point connection between the MCH and the Intel® 82801ER I/O controller hub or Intel® 6300ESB I/O controller hub provides 266 MB/s of bandwidth.
Advanced platform RAS
  • Features such as memory Error Correction Code (ECC), Intel® x4 Single Device Data Correction2 (x4 SDDC), DIMM sparring, DIMM scrubbingand memory mirroring can improve system reliability.
  • 32-bit CRC on PCI Express*.
  • SMBus port hooks into Intel® E7520 and Intel® E7320 chipsets for remote management operation and support for variety of third-party Base Management Controller (BMC) and BIOS solutions.


Related products

Processors
Chipsets
Server BoardsIntel® Server Boards SE7520AF2, SE7520BD2, SE7520JR2, and SE7320SP2
Server ChassisIntel® Server Chassis SR1400 and SR2400
RAID ControllerIntel® RAID Controllers SRCU42E and SRCZCRX
Other


Packaging information

Intel® E7520 Memory Controller Hub (MCH)1077 Flip Chip-Ball Grid Array (FC-BGA)
Intel® E7320 Memory Controller Hub (MCH)1077 Flip Chip-Ball Grid Array (FC-BGA)
Intel® 6700PXH 64-bit PCI hub

The Intel® 6700PXH 64-bit PCI Hub is targeted for the server market. It is a peripheral component that performs PCI bridging functions between the PCI Express* interface and the PCI Bus. It contains two PCI bus interfaces that can be independently configured to operate in PCI (33 or 66 MHz) or PCI-X Mode 1 (66, 100, or 133 MHz), for either 32 or 64 bit PCI devices. It further supports the new PCI Standard Hot-Plug Controller and Subsystem Specification Revision 1.0.

File Type/Size:  PDF 2271KB

567 Flip Chip-Ball Grid Array (FC-BGA)
Intel® 82801ER (ICH5R)460 Micro Ball Grid Array (µBGA)
Intel® 6300ESB I/O Controller Hub689 Plastic Ball Grid Array (PBGA)

1PCI Express* reduced power-state L0s not supported.

2In an x4 DDR memory device, the Intel® x4 Single Device Data Correction (x4 SDDC) provides error detection and correction for 1 to 4 data bits within a single device and provides error detection for up to 8 data bits within two devices.

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