Intel® Q35/Q33/G33/P35 Express Chipset Thermal and Mechanical Design Guidelines

—For the 82Q35, 82Q33, 82G33 Graphics and Memory Controller Hub (GMCH) and 82P35 Memory Controller Hub (MCH)

This document presents the conditions and requirements to properly design a cooling solution for systems that implement the (G)MCH. Properly designed solutions provide adequate cooling to maintain the (G)MCH case temperature at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the case to local-ambient thermal resistance. By maintaining the (G)MCH case temperature at or below those recommended in this document, a system designer can ensure the proper functionality, performance, and reliability of this component.

This document is for the following devices:

    Intel® 3 Series Chipsets Datasheet 316966

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