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Thermal Data for the 540-Lead PBGA Package Application Note
This document expands on the thermal analysis section (section 3.2.2) of
the 80960RM/RN/RS datasheets. This data was collected for the 540-lead
PBGA package used on the 80960RM/RN/RS. Since the 80303 I/O
processor uses the identical package and is roughly the same die size,
this analysis can be used for that processor as well.
Specification Update for this document: 273355.htm
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