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Intel® Carrier Grade Server TIGI2U
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Innovative, NEBS-3/ETSI-Certified 2U Rack Server Supporting Next-Generation Telecom Solutions Optimized for Computation

Intel® Carrier Grade Server TIGI2U is a NEBS-3 and ETSI- certified Carrier Grade Rack Server. This server is a perfect fit for the demanding environment and limited space of the Central Office or highly available data centers, VoIP and communications networks. It is ideal for the convergence of Voice and IP for next-generation telecom solutions. Carrier Grade Server TIGI2U is a high performing, competitively positioned server which meets the rigid standards of the Central Office, offers robust server management, high availability, and an extended life cycle for excellent customer investment protection.
  Intel® Carrier Grade Server TIGI2U
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An Innovative Server for Any Environment Carrier Grade Features
Intel® Carrier Grade Server TIGI2U is a NEBS-3 and ETSI-certified server which can withstand extreme heat, humidity, altitude, zone 4 earthquake shock, and is flame-resistant.

Advanced Server Management
Intel® Server Management and Telco Alarm Management features provide visual, audible (optional) and SNMP event indications of faults. These features are consistent with the rigid requirements of the Telecom Central Office environment.

Extended Life Cycle
Intel® Carrier Grade Server TIGI2U offers Extended Life Cycle (ELC) which comprises longer product availability, longer warranty and spares support for excellent customer investment protection.
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Intel® Carrier Grade Server TIGI2U Features
Features Benefits
High-density 2U Height 20.0 inch depth compatible with 600-mm standard telecom rack.
Configuration Flexibility 2 way capability in thin profile and cost/value effective packaging Stand-alone system supporting Intel® Xeon® processor at 3.2 GHz / 2M L2 cache with 800-MHz FSB
Availability Single or dual 600-W power supply in AC or DC configuration
Manageability Remote management via LAN port: In Band (OS present) / Out of Band (OS absent) support; IPMI 1.5 compliant; WfM 2.0 compliant
Investment protection Supports Intel® Xeon® processor family
System-level Scalability 256-MB to 16-GB DDR2 400-MHz SDRAM memory support; Dual Intel® Xeon® processor support; Support for up to 3 low profile or 3 full-height / full-length 64-bit x 100-MHz PCI-X adapters; 2 internal U320 SCSI disk drives (hot swap and front accessible); Slimline CD-ROM (option for DVD support)
Front panel Power switch
Reset switch
NMI switch
Main power
HDD activity LED
NIC activity LED
Telco power alarm fault LED/Relay
Telco power alarm fault LED/Relay
Telco power alarm fault LED/Relay
Telco power alarm fault LED/Relay
Related Products
Processors Intel® Xeon® Processor
Intel® Carrier Grade Servers
Intel® Carrier Grade Server TIGPT1U
Intel® Carrier Grade Server TIGPR2U
Other
Intel® Server Management
Intel® PRO Server Adapters
Intel® Carrier Grade Server TIGI2U Specifications
Server Physical Dimensions
Height 3.45 inches (87.6 mm)
Width 17.14 inches (435.3 mm)
Depth 20 inches (508 mm)
Front clearance 2 inches (50.8 mm)
Side clearance 1 inches (25.4 mm)
Rear clearance 3.6 inches (92 mm)
Regulatory Compliance
Intel® Carrier Grade Server TIGI2U complies with the following Safety, EMC and NEBS regulations
Safety
U.S., Canada UL1950 - CSA 950 (UL and cUL)
Europe, CE Mark EN60950 (complies with 73/23/EEC)
International IEC60950 (CB Report and Certificate)
Russia GOST
EMC
U.S. FCC, Part 15, Class A
Canada ICES-003, Class A
Europe, CE Mark EN55022 (Class A); EN55024 and EN61000-3-2;-3-3 (complies with 89/336/EEC)
International CISPR 22, Class A
Japan VCCI, Class A
Taiwan CNS13438, Class A
Korea RRL, MIC 1997-41 and 1997-42
Russia GOST
Australia, New Zealand AS/NZS 3548 (based on CISPR 22)
China CCC
NEBS/ETSI
Bellcore GR-63, Physical Protection Requirements
Bellcore GR-1089, Electromagnetic Compatibility and Electrical Safety Req.
ETSI 300 386, Telecommunication Network, Electromagnetic Compatibility
ETSI 300 019, Environmental Conditions and Environmental Tests
ETSI 753, Acoustic Noise

All products, dates, and figures specified are preliminary based on current expectations, provided for planning purposes only, and are subject to change without notice. Availability in different channels may vary. Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.

Intel, the Intel logo, and Intel Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States.

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