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What are the layout recommendations for the Intel® Pentium® II - Low Power's LPGTL+ PSB (processor side bus)?
The LPGTL+ layout recommendations are available from your Intel Field Sales Representative.
What is involved in migrating from the Intel Pentium II - Low Power processor to the Intel® Pentium® III Low Power processor?
This will require a board redesign. These processors use a different size package. The Pentium II - Low Power uses a 615 ball BGA1 package while the Pentium III - Low Power uses a 495-ball BGA2 package. Also, the Pentium III - Low Power uses internal pull-ups for the GTL+ PSB; it does not require external pull-ups. The Pentium II - Low Power requires external pull-ups.
Does Intel have any recommendations for thermal solutions for the Pentium II - Low Power Processor?
Please contact your Intel Field Sales Representative for this information.
Where can I find the latest Microcode updates for the Pentium II - Low Power processor?
Please contact your Intel Field Sales Representative for this information.
Is there a design guide available for the Pentium II - Low Power Processor?
The Pentium II processor - Low Power interfaces with the 440BX chipset. The design guide is available from your local Intel Field Sales Representative.
Where can I find information (pad layout, assembly, rework, etc.) on the 615 BGA1 (H-PBGA) package?
This information can be found in Chapter 14 of the Intel® Packaging Databook. Moisture sensitivity information can be found in Chapter 8.
Consult the Pentium II processor - Low Power datasheet for BGA1 package dimensions. |
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Intel® Pentium®