Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines
This document discusses thermal management and measurement techniques for the Intel® Xeon® processor 5300 series, which is intended for dual processor server and and workstation platforms. It address the issues of the integrated thermal management logic and its impact on thermal design. The physical dimensions and power numbers used in this document are for reference only. Please refer to the Intel Xeon processor 5300 series datasheet for the product dimensions, thermal power dissipation and maximum case temperature. In case of conflict, the data in the datasheet supersedes any data in this document.
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