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Intel® E7501 ChipsetOverview

  • Overview
  • Technical Documents
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The second in a family of volume server chipsets, the Intel® E7501 chipset supports dual-processor (DP) server systems optimized for the Intel® Xeon® processor. The Intel E7501 chipset design delivers maximized system bus, memory and I/O bandwidth to enhance performance, scalability and end-user productivity while providing a smooth transition to next-generation server technologies.

Platform Features that Maximize Performance

Dual Intel® Xeon® processors with a 533 MHz system bus provide up to 4.3 GB/s of available bandwidth.

Dual DDR-266 memory channels operate in lock-step to provide up to 4.3 GB/s of memory bandwidth.

Three hub interface 2.0 connections provide multiple high-bandwidth I/O configuration options, yielding up to 3.2 GB/s of I/O bandwidth.

Product information

  • Motherboard and Barebones Selector Guide
  • Server Chipset Comparison Chart

Features and benefits

Supports 2 Intel® Xeon® processors with 512 KB L2 cache for dual-processing server systemsDelivers a platform that brings Intel NetBurst® microarchitecture and the Hyper-Threading Technology of the Intel® Xeon® processor to deliver best-in-class performance for peak server workloads.
533 MHz system bus capabilitySupports a high-performance platform by enabling a 4.3 GB/s system bus bandwidth that can support greater memory and I/O bandwidths.
Intel® Hub Architecture 2.0 connection to the MCHThis point-to-point connection between the MCH and the 3 Intel® 82870P2 controller hub devices provides greater than 1 GB/s of bandwidth. Error Correction Code (ECC) protection, coupled with high data transfer rates, support I/O segments with greater reliability and faster access to high-speed networks.
Intel® 82870P2 controller hubIntroduces next-generation PCI/PCI-X performance and significantly enhances platform flexibility. Two independent 64-bit, 133 MHz PCI-X segments and 2 hot-plug controllers (1 per segment) for each Intel 82870P2 controller hub device allow up to 6 PCI-X buses per system.
Dual-channel DDR-266 memory interfaceOffers a maximum memory bandwidth of 4.3 GB/s through a 144-bit wide, 266 MHz Double Data Rate (DDR) SDRAM memory interface with densities up to 512 megabits.
Advanced platform RASUMProvides a more reliable platform with features such as memory Error Correction Code (ECC) with Intel® x4 Single Device Data Correction1, hardware memory scrubbing, MCH SMBus target interface, hub interface ECC, and the availability of enhanced error status information maintained through reset.


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Packaging information

1005-pin Flip Chip-Ball Grid Array (FC-BGA)
421-pin Ball Grid Array (BGA)
567-pin Flip Chip-Ball Grid Array (FC-BGA)

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