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System Memory Features
The board has two DIMM sockets and supports the following memory features:
- 2.6 V (only) DDR SDRAM DIMMs with gold-plated contacts
- Unbuffered, single-sided or double-sided DIMMs with the following restriction: Double-sided DIMMs with x16 organization are not supported
- 2 GB maximum total system memory
- Minimum total system memory: 128 MB
- Non-ECC DIMMs
- Serial Presence Detect
- DDR 400 MHz and DDR 333 MHz SDRAM DIMMs
Note
To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined frequency.
Supported DIMM Configurations
| DIMM Capacity |
Configuration |
SDRAM Density |
SDRAM Organization Front-side/Back-side |
Number of SDRAM Devices |
| 128 MB |
SS |
256 Mbit |
16 M x 16/empty |
4 |
| 256 MB |
SS |
256 Mbit |
32 M x 8/empty |
8 |
| 256 MB |
SS |
512 Mbit |
32 M x 16/empty |
4 |
| 512 MB |
DS |
256 Mbit |
32 M x 8/32 M x 8 |
16 |
| 512 MB |
SS |
512 Mbit |
64 M x 8/empty |
8 |
| 512 MB |
SS |
1 Gbit |
64 M x 16/empty |
4 |
| 1024 MB |
DS |
512 Mbit |
64 M x 8/64 M x 8 |
16 |
| 1024 MB |
SS |
1 Gbit |
128 M x 8/empty |
8 |
| 2048 MB |
DS |
1 Gbit |
128 M x 8/128 M x 8 |
16 | | Note:
In the second column, "DS" refers to double-sided memory modules (containing two rows of DDR SDRAM) and "SS" refers to single-sided memory modules (containing one row of DDR SDRAM).
Tested Memory
Vendor Self Tested Memory
Intel supplies the memory vendors that participate in this program with a common memory test plan to use as a basic checkout of the memory stability. Memory listed here was either tested by the memory vendor or by Intel using this test plan. These part numbers may not be readily available throughout the product life cycle.
The table below lists parts which passed testing conducted using Intel's Self Test program for Intel® Desktop Board D910GLDW. For a complete explanation of the self test see the Desktop Board Component Functional Testing Levels page.
Module Supplier
Module Part Number |
Module Size
(MB) |
Module Speed
(MHz) |
Latency
CL-tRCD-tRP |
ECC or
Non-ECC? |
DIMM
Organization |
Module
Date Code |
Component Used
Comp Part Number |
Infineon Technologies*
HYS64D128320HU-5-B |
1GB |
400 |
3-3-3 |
Non-ECC |
DSx8 |
0445 |
Infineon Technologies
HYB25D512800BE-5 |
Infineon Technologies
HYS64D64320HU-5-C |
512MB |
400 |
3-3-3 |
Non-ECC |
DSx8 |
0436 |
Infineon Technologies
HYB25D512800CE-5 |
Infineon Technologies
HYS64D32300HU-5-C |
256MB |
400 |
3-3-3 |
Non-ECC |
SSx8 |
0432 |
Infineon Technologies
HYB25D512800CE-5 |
Kingston Technology*
KVR400X64C3A/1G |
1 GB |
400 |
3-3-3 |
Non-ECC |
DSx8 |
0518 |
Infineon
HYB25D512800BE-5 |
Kingston Technology
KVR400X64C3A/1G |
1 GB |
400 |
3-3-3 |
Non-ECC |
DSx8 |
449 |
Samsung*
K4H510838B-TCCC |
Kingston Technology
KVR400X64C3A/512 |
512 MB |
400 |
3-3-3 |
Non-ECC |
SSx8 |
0518 |
Micron*
MT46V64M8-5B |
Kingston Technology
KVR400X64C3A/512 |
512MB |
400 |
3-3-3 |
Non-ECC |
DSx8 |
0000 |
Samsung
K4H560838F-TCCC |
Kingston Technology
KVR400X64C3A/256 |
256MB |
400 |
3-3-3 |
Non-ECC |
SSx8 |
0000 |
Promos*
V58C2256804SCT5B |
Samsung
M368L2923CUN-CCC |
1 GB |
400 |
3-3-3 |
Non-ECC |
DSx8 |
0509 |
Samsung
K4H510838C-UCCC |
Samsung
M368L6423ETN-CCC |
512 MB |
400 |
3-3-3 |
Non-ECC |
DSx8 |
0509 |
Samsung
K4H560838E-TCCC |
Samsung
M368L6423FTN-CCC |
512 MB |
400 |
3-3-3 |
Non-ECC |
DSx8 |
0506 |
Samsung
K4H560838F-TCCC |
Samsung
M368L6523CUS-CCC |
512 MB |
400 |
3-3-3 |
Non-ECC |
SSx8 |
0503 |
Samsung
K4H510838C-UCCC |
Samsung
M368L3223FTN-CCC |
256 MB |
400 |
3-3-3 |
Non-ECC |
SSx8 |
0506 |
Samsung
K4H560838F-TCCC |
Samsung
M368L3324CUS-CCC |
256 MB |
400 |
3-3-3 |
Non-ECC |
SSx16 |
0506 |
Samsung
K4H511638C-UCCC |
Samsung
M368L3223ETN-CCC |
256 MB |
400 |
3-3-3 |
Non-ECC |
SSx8 |
0506 |
Samsung
K4H560838E-TCCC |
Infineon Technologies
HYS64D128320HU-6-B |
1GB |
333 |
2.5-3-3 |
Non-ECC |
DSx8 |
0434 |
Infineon Technologies
HYB25D512800BE-6 |
Infineon Technologies
HYS64D64320HU-6-C |
512MB |
333 |
2.5-3-3 |
Non-ECC |
DSx8 |
0436 |
Infineon Technologies
HYB25D512800CE-6 |
Infineon Technologies
HYS64D32300HU-6-C |
256MB |
333 |
2.5-3-3 |
Non-ECC |
SSx8 |
0436 |
Infineon Technologies
HYB25D512800CE-6 |
Micron
MT16VDDT6464AG-40BGB |
512MB |
400 |
3-3-3 |
Non-ECC |
DBx16 |
0511 |
Micron
MT46V32M8TG |
Micron
MT16VDDT12864AG-335DB |
1024MB |
333 |
2.5-3-3 |
Non-ECC |
DBx8 |
0519 |
Micron
MT46V64M8TG |
Micron
MT16VDDT12864AY-335DB |
1024MB |
333 |
2.5-3-3 |
Non-ECC |
DBx8 |
0438 |
Micron
MT46V64M8P |
Samsung
M368L5623MTN-CB3 |
2 GB |
333 |
2.5-3-3 |
Non-ECC |
DSx8 |
0508 |
Samsung
K4H1G0838M-TCB3 | |
Updated: September 6, 2005
This applies to:
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