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The white material on the bottom of the heatsink included with the Boxed Pentium® III processor in the FC-PGA package is thermal interface material. The thermal interface material is used to efficiently transfer heat from the top of the processor die to the heatsink, where the heat will be dissipated by the heatsink fins and fan.
It is important to understand the impact of factors related to the interface between the processor and the heatsink base. Specifically, the bond line thickness, interface material area and interface material thermal conductivity should be managed to realize the most effective thermal solution. The Boxed Pentium® III processor uses a thermal interface material that has been extensively validated, and provides thermal dissipation performance required to maintain proper processor thermal specifications.
Intel does not recommend the removal of the thermal interface material located
on the bottom of the boxed processor fan heatsink. Removal of this material
may cause damage to your processor and may void your processor
warranty. If you must replace the thermal material, contact Intel Customer Support to receive a replacement heatsink. There is no effective process to remove the
thermal material and then re-attach new material without the use of special
equipment and tools.
This applies to:
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