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Fan heatsink that provide appropriate airflow for the processor and nearby board components must meet specific requirements. Failure to use an adequate fan heatsink and a chassis with appropriate airflow may result in reduced performance or, in some instances, damage to the motherboard.
In a system environment, the processor temperature is a function of both system and component thermal characteristics. The system level thermal constraints consist of the local ambient air temperature and airflow over the processor as well as the physical constraints at and above the processor. The processor temperature depends on the component power dissipation, size and material (effective thermal conductivity) of the integrated heat spreader, and the presence of a thermal cooling solution.
The fan heatsink bundled with the Boxed Pentium® 4 processor provide the correct amount of airflow for the processor.
For a list of chassis that have been tested with Intel® Desktop Boards please refer to the following website: http://developer.intel.com/design/motherbd/cooling.htm.
Also available is the Pentium® 4 processor Thermal Design Guideline additional thermal management information.
† Look for systems with the Intel® Pentium® 4 Processor with HT Technology which your system vendor has verified utilize Hyper-Threading Technology. Performance will vary depending on the specific hardware and software you use.
Get more information here.
This applies to:
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