As part of our environmental initiative, Intel is working with our suppliers, customers, and several industry consortia to develop and provide EU RoHS (European Union Restriction of Hazardous Substances) compliant products.
Intel has completed certification of EU RoHS compliant materials and processes, and is manufacturing and shipping many EU RoHS compliant products today. Additional EU RoHS compliant products will be added to Intel's product portfolio as customer demand and business conditions allow.
Intel provides Material Declaration Data Sheets (MDDS) to demonstrate compliance to EU RoHS. Many, but not all, MDDSs are located at http://intel.pcnalert.com/. If you have difficulty finding the correct MDDS, or have a general RoHS inquiry, send an email to rohs@intel.com.
Note: Most Intel MDDSs contains EU RoHS information, and China RoHS information.
Material Declaration Data Sheets (Material Content)
Q1. Please provide an update on the status of RoHS compliant Intel products.
A1. The first step was to certify RoHS compliant materials for our products where required. We have completed that phase of the transition. The second step was to certify manufacturing processes with the new RoHS compliant materials. We are now shipping millions of RoHS compliant products per week. Many RoHS compliant products are on the product group roadmaps, and more are being added as customer demand and as business conditions permit. Contact your Intel Field Sales Representative for product specific information and availability.
Q2. Are Intel desktop & mobile platform product RoHS compliant?
A2. The most recent platform product releases are RoHS compliant, and some prior generation platform product are available in RoHS compliant versions. Contact your Intel Field Sales Representative for product specific information and availability.
Q3. Are other Intel products RoHS compliant?
A3. Yes, many other Intel products are RoHS compliant, including communications components, and many cards and mother boards shipped by Intel.
Q4. I hear the terms Pb-free (Lead-free) and Pb-free 2LI (second level interconnects). What is the difference?
A4. First some background information. It is important to understand that the industry is transitioning to RoHS compliant products. RoHS restricts the use of 6 materials. One of the 6 restricted materials is Pb. RoHS compliant products are not completely Pb free. There are exemptions in RoHS allowing the use of Pb in some very limited locations in electronic products, and/or in some applications. In addition, Pb maximum concentration values have been established for RoHS compliant electronic products that allow up to 1000 ppm of Pb. Pb is the most common and problematic of the 6 restricted materials and therefore "Pb-free" is a nickname that is often used (or misused) for RoHS compliant products.
The term "Lead-free / Pb-free" means that Pb has been removed where required by the RoHS legislation. Pb may exist as an impurity below 1000ppm.
The term "Lead-free 2LI / Pb-free 2LI" means Pb-free second level interconnects. The balls, leads, or pads used to connect the component to the printed circuit board are Pb-free, but the first level interconnect (FLI) is not Pb-free. The use of Pb in the FLI is acceptable because of the RoHS "flip chip" or "die bump" interconnect exemption.
Q5. Is Intel planning to remove lead from the FLI?
A5. Yes. On May 22, 2007 we announced that our future processors, beginning with the entire family of 45 nanometer (nm) high-k metal gate (Hi-k) processors are going to be lead/Pb-free. A great deal of engineering work had to be completed in order to integrate a new solder alloy system with the complex structure of Intel's advanced silicon technologies and demonstrate the high level of quality and reliability expected of Intel components. Intel's implementation of 100 percent lead-free technology goes beyond the European Union's current RoHS legislative requirements and does not require the use of any exemptions. These products are on target to begin production in the second half of 2007. For more information on this and other Intel environmental initiatives, go to www.intel.com/pressroom/ (March 22, 2007 press release), and www.intel.com/go/responsibility.
Q6. How can I get the chemical content of Intel products? My compliance department requires it.
A6. MDDS are available on the internet at http://intel.pcnalert.com/. If the MDDS that you are searching for is not available at this location contact your Intel representative or service and support organization. MDDSs can also be requested by sending an email to rohs@intel.com. The MDDS contains industry reportable chemical content.
Q7. I need to be able to demonstrate RoHS compliance to my customers for my products. Will Intel provide a Certificate of Conformance or a Supplier Declaration of Conformance?
A7. The MDDS that Intel provides is a document that you can file demonstrating conformance or RoHS compliance of Intel product. MDDSs are package specific, not product specific. Intel MDDSs contain a RoHS declaration.
Q8. Does Intel intend to mark its product with any distinguishing features that will allow us to easily identify product that contains lead (Pb) from product that is Pb-free?
A8. Yes, Intel will mark its new product per JEDEC Standard JESD97 (Marking, Symbols, and Labels for Identification of Lead Free Assemblies, Components, and Devices) and/or IPC 1066 (Marking, Symbols and Labels for identification of Lead-Free and Other Reportable Materials in Lead-Free Assemblies, Components and Devices). Also, if Intel offers both SnPb and Pb-free versions of a product, the Pb-free product will have a unique part number.
Note: Some Intel® processors in the FCPGA package introduced prior to 2004 may not have the distinguishing mark.
Q9. What is the peak temperature rating and moisture sensitivity level (MSL) of your Pb-free product?
A9. Intel is targeting 260°C, however some products may not be able to meet that target. Intel intends to comply with J-Std-020 MSL requirements, which establishes the peak temperature rating and MSL by package size. Contact your Intel sales representative if you need specific peak temperature rating and MSL product information.
Note: This information is included on the box and bag labels for all component product shipments.
Q10. Many Intel processors are in Pin Grid Array (PGA) packages. The leads do not contain Pb. Are these packages Pb-free and RoHS compliant?
A10. Desktop and mobile processors in flip chip PGA packages only contain Pb in the first level interconnects (FLI). Intel's use of Pb in the FLI is exempt from RoHS under the "flip chip" exemption. Desktop & mobile processors in FCPGA packages are RoHS compliant. Contact your Intel representative for information regarding server microprocessors.
Note: FLI is the die bump to package substrate connection.
Q11. What Pb-free alloys has Intel selected for its RoHS product?
A11. Most BGA packages are Sn / 4.0 Ag / 0.5 Cu (Sn=tin, Ag=silver, Cu=copper). Plan of record for lead-frame through-hole and SMT packages is matte tin. The FCPGA & FCLGA products already have Pb-free pins/pads.
Note: Intel continues to evaluate alternative Pb-free alloys and may transition products to alternative alloys if alternative alloys improve product performance.
Q12. Some companies do not want to use 100% tin plated product because of the potential for tin (Sn) whiskers. How is Intel addressing this issue?
A12. Intel 100% tin plated Cu lead frame product is annealed at 150°C for a minimum of 1 hour within 24 hours of the Sn plating to reduce the potential for Sn whiskers. Intel continues to participate in industry consortia forums where Pb-free solutions are discussed for lead-frame products used in the electronics industry. Intel is participating in an industry effort to develop robust tin plate processes and test methods for lead frame products, and is performing internal testing. Contact your Intel representative if you have any additional questions.
Q13. How can I find out if a specific RoHS compliant product is available from Intel?
A13. Most Intel product groups have integrated Pb-free products into their standard roadmaps. Your Intel representative has access to this roadmap information and should be able to respond to your RoHS product availability questions.
Q14. Will Intel continue to offer SnPb (tin lead) products?
A14. The short answer is where customer demand and business conditions permit.
Q15. Are Intel products backwards compatible (use of Pb-free alloy product with SnPb paste)?
A15. Lead frame products with 100% tin on the leads are backwards and forwards compatible. It is necessary on most lead-frame products to change the mold compound and possibly other materials in the package to maintain an acceptable MSL rating at the elevated Pb-free processing temperatures. Customers need to ensure that tin plated lead-frame product is rated at Pb-free processing temperatures.
China RoHS
Q16. What is China RoHS (Restriction of Hazardous Substances)?
A16. China RoHS is the term used by industry generally to describe legislation implemented by the Ministry of Information Industry (MII) in the People's Republic of China for the control of pollution by electronic information products (EIP). The official name of China RoHS is Management Methods for Controlling Pollution by Electronic Information Products. China RoHS went into effect on March 1, 2007. The first phase of implementation involves labeling and material content disclosure requirements. A future phase of China RoHS will require pre-market testing and certification of products that are listed in a yet-to-be-released "catalogue". China RoHS includes the same 6 materials restricted by EU RoHS, but there are differences in the way it is implemented when compared to EU RoHS.
Q17. What electronic information products (EIP) are affected by China RoHS?
A17. Some of the EIPs that are affected by China RoHS are: Communication products (e.g., cell phones), televisions, computer products, servers, networking equipment, video game consoles, household electronic products, electronic measurement and instrument products, and more. The scope of electronic products includes components of electronic equipment, but does not include white goods such as refrigerators and washing machines.
Q18. What is Intel doing to prepare for China RoHS?
A18. China RoHS labeling and disclosure requirements vary for business-to-business (B2B) and business-to-retail/consumer (B2C) products. For B2B products, MII has stated that the label and material Self Declaration Table (SDT) only needs to be provided to the business. For B2C products, MII has indicated that the label must be on the product (or in the product literature if size limitations make product labeling impracticable). The SDT must be included in the product literature. To meet these requirements Intel will provide China RoHS information to B2B customers via MDDS and the internet. Intel will provide retail customer China RoHS information via the product labeling and product literature. Specifics are provided below:
Components products (Business to Business): The China RoHS label or Environmental Friendly Use Period (EFUP) label, and the material Self Declaration Table (SDT) is being added to Intel MDDSs.
Note: EFUP is also referred to as Environmental Protection Use Period (EPUP).
Cards, Boards, and Systems (Business to Business): Material SDTs are being added to Intel MDDSs. The China RoHS label or EFUP label will be on the MDDS or posted on the internet. Eventually the EFUP label will be printed on the card/board where space permits.
Boxed processors (Retail): The EFUP label and SDT will be included in MDDSs. The EFUP label and SDT will be in the product literature.
Boxed motherboards (Retail): The EFUP label will be a sticker on the board or label screened on the board. The SDT will be included in the product literature.
Q19. Is Intel compliant to China RoHS?
A19. China RoHS is effective March 1, 2007. Intel will comply with China RoHS and is moving forward with the preparations mentioned above.
Q20. I already have MDDSs from Intel for EU RoHS. Is there anything else I need for China RoHS?
A20. Most MDDSs have been revised to include China RoHS or EFUP label and the SDT.
Note: There is adequate information on the previous MDDS format to create a SDT.
Q21. I need more information regarding China RoHS. Where can I get more information? Can Intel provide it?
A21. The official China web site is www.mii.gov.cn. However, the information on this web site is in Chinese. If you need information in English, try the American Electronics Association (AeA) web site, which can be found at http://www.aeanet.org/GovernmentAffairs/gabl_ChinaRoHSpage0905.asp. Some information is available to the general public, and some information is available to members only.
Q22. How do you determine the EFUP number?
A22. An EFUP standard has not yet been finalized by MII. There is still discussion within the electronics industry on EFUP dates, but the industry appears to be harmonizing on: consumer electronics = 10 years; server assemblies = 20 years; telecom assemblies = 30 years. This may change as further harmonization within the electronics industry occurs.
Q23. I need MDDSs with a China RoHS or EFUP logo and material SDT information now. Where do I get it?
A23. Many Intel MDDSs are located at http://intel.pcnalert.com/. If you cannot locate the MDDS you are looking for there, contact your Intel field support person, or send an email to rohs@intel.com.
Q24. I have some additional questions regarding Intel and China RoHS. Who do I contact?
A24. Contact your Intel field support person, or send an email to rohs@intel.com.
Q25. I understand that China is also requiring recycle symbols on product packaging. Is Intel compliant with China's packaging labeling law?
A25. Yes. China MII has stated (clarified) that all new packaging materials require the recycle symbols, existing packaging materials do not. Guidance has also been provided by MII regarding B2B & B2R packaging material recycle symbol requirements. All new Intel packaging materials will include the recycle symbols. Many of Intel's existing packaging products already include the required China packaging recycle symbols. Based on guidance by MII, not all Intel packaging materials require recycle symbols (since most are B2B).
Q26. Does China RoHS require testing?
A26. China RoHS will require pre-marketing testing in the future. The testing requirements will only go into effect when a product is listed in MII's catalogue. The first catalogue of products is expected to be published in late 2007.
Acronyms:
C: Centigrade
FCLGA: Flip-chip land grid array
FCPGA: Flip-chip pin grid array
FLI: First level interconnect
ppm: Parts per million
Updated March 10, 2007
The information provided above is the opinion of Intel Corporation (Intel) at this time and is provided for information only. Use at your own risk. The information is subject to change without notice. Check this site regularly for updates.
This information is provided by Intel as a service to our customers. Intel accepts no responsibility to update the information provided. Intel makes no representation as to the completeness or accuracy of the above information. Intel makes no warranties of any kind, either express or implied with regard to the information provided, and Intel accepts no liability for any damages suffered by anyone for any reason based, in whole or in part, on the information provided above.
